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Experimental & Numerical Investigation of Aluminum Extrusion Through Pocket Dies

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Experimental and Numerical Investigations of Aluminum Extrusion Through Pocket Dies

Dariusz Leśniak, Wojciech Libura, Józef Zasadziński, AGH University of Science and Technology, Poland,
Buntoro, Klaus Müller, Technical University of Berlin, Germany, and
Jeffrey Fluhrer, Scientific Forming Technologies Corporation, United States

Track: DIE DESIGN AND TECHNOLOGY - Finite Element Method

ABSTRACT --- To-date requirements of the aluminum market are oriented to the
profiles of complicated shapes demonstrating the highest possible quality. Correct
shape of the profile depends on many technological factors and the proper die design.
The most important factor is to facilitate the conditions for uniform metal flow through
the die orifice. In order to ensure this using the pocket dies, it is necessary to
understand the influence of pocket geometry on metal flow, and consequently on the
dimensional stability of the profile being extruded. Therefore, experimental and
numerical investigations of the aluminum extrusion profile with different wall thickness
through pocket dies were carried out. The FEM was applied in numerical calculations
and the extrusion trials of AlMgSi (6060) alloy were performed. The criterion for pocket
design was proposed. It was shown that the use of optimized pocket die leads to the
best geometrical stability of the extrudate. Investigations revealed that the pocket dies
affect the shape of dead metal zones in the billet and, thereby, create a possibility to
even the velocity distribution of metal flow within the deformation zone. They also
contribute to changes of temperature field in the deformation zone. Moreover, it was
found that the use of pocket dies is associated with the increase in extrusion force of
about 20 percent, compared to extrusion through a flat die.

© Extrusion Technology for Aluminum Profiles Foundation (ET Foundation). All rights reserved. No part of The Proceedings may be reproduced in any form without the express written permission of the ET Foundation.

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