Print Page | Sign In | Join
Online Store: ET '08 Individual Papers
Main Storefront

Process Engineering Modeling: A Ticket to Higher Efficiency

Item Options
Sign in for your pricing!
Price: $20.00
Quantity: *

Process Engineering Modeling: A Ticket to Higher Efficiency in Aluminum Extrusion

Wojciech Misiolek, Institute for Metal Forming, Lehigh University, Pennsylvania, USA
Richard M. Kelly, Werner Co., Greenville, Pennsylvania, USA

Track: EXTRUSION/DIE, THEORETICAL - Modeling and Simulation

ABSTRACT --- Individual scientific studies in metal flow, billet metallurgy,
metal and tooling interface, have separately provided manufacturing efficiency
improvements in aluminum extrusion. With the advent of significant increases in
computer power, sophistication and speed, these technological advances may be
modeled and evaluated in concert, rather than as segmented pieces. The
complement of a more comprehensive process modeling approach is expected to
yield higher gains, contingent upon corresponding accuracy refinements in
material characterization, such as flow stress  temperature relations for high
localized strains. Identification and abatement of restrictive process limitations
will be more progressive using analyses, which include multiple interaction
effects. A review of performed studies in university laboratories and their
application into the industrial practice is presented. A discussion on how these
results can be implemented into engineering software is provided. Additionally,
some suggestions for future collaboration between the software development
community and researchers in metallurgical laboratories, as well as practicing
engineers on the extrusion floor are made. It is important, in the authors’
opinion, to intensify a dialogue among interested parties since the proposed
collaboration can yield very important tools used by people involved in
manufacturing, research, and training.

© Extrusion Technology for Aluminum Profiles Foundation (ET Foundation). All rights reserved. No part of The Proceedings may be reproduced in any form without the express written permission of the ET Foundation.